Newsletter
Recent reports indicate that the TSMC 2nm production process might be delayed from its original timeline. Previous reports have it that TSMC had intentions to kick off the production of the next node of chips by the year 2025. However, due to certain factors, this production process might face delay, pushing it a year forward from its original time frame.
This coming processor node is going to be groundbreaking for TSMC as it will introduce the usage of new technology (GAA) to the firm. Companies like Apple and Qualcomm will put this coming node to use on their coming processor line-ups. Well, these companies will have to wait for another year before they get their hands on the new 2nm node that TSMC has in the pipeline.
The reason behind this delay has something to do with setting up the necessary facility for the development of this node. TSMC seems to be facing some challenges in setting up this production facility and the development of the 2nm node will be affected by this. While TSMC worries about this delay, it also needs to worry about the competition that will be ahead of them with releasing the 2nm node for chip production.
While the TSMC 2nm production process struggles, the competition might join the fast lane
The challenges that are delaying the setting up of TSMC’s new foundry for the 2nm node production are causing problems for the company. This delay is already pushing back the start of the production process for the 2nm node for use in smartphones and gadgets. Another major concern this delay will bring is that the competition might be ahead of TSMC.
Samsung Foundry is one of TSMC’s biggest rivals in the chip production industry. Unlike TSMC, the Samsung Foundry isn’t facing any issue that might delay the production of their 2nm process. The Foundry will get its 2nm node ready by 2025 a year ahead of TSMC.
Intel, another major competition for TSMC, is also preparing to make its chips more powerful. They’ll get this done by adding backside power delivery to their chips. Reports have it that this backside power delivery also known as Power Via will be ready by next year.
Once available, this will boost the performance of coming Intel-designed chips. By 2025, Intel will kick off the development of its 18A or 1.8nm node, which will ship to manufacturers for usage in the industry. TSMC and Samsung Foundry might get Power Via technology into their 2nm chips by 2026 or later.
Just one delay in the production process of the TSMC 2nm node might put them behind the competition. Despite rolling out 3nm chips on smartphones first, TSMC might take the backseat for the 2nm process. In the coming months, more details on this and the development of other chip foundries will become available.