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The upcoming Samsung Galaxy A55 has bagged two new certifications. These include the Bluetooth SIG and TUV Rheinland. The latest certifications hint at the imminent arrival of the smartphone. The phone has already been spotted on the Geekbench benchmarking platform as well as in leaked renders.
Samsung Galaxy A55 bags two new certifications
The Samsung Galaxy A55 has appeared on the Bluetooth SIG and TUV Rheinland websites with model number SM-A5560, SM-A556E, and SM-A556B. The former two could be for the Asian markets while the SM-A556B could be for the European region.
The Bluetooth SIG database reveals that it will support Bluetooth 5.3 connectivity. Meanwhile, the TUV Rheinland listing mentions that the device will come with a 9V DC adapter supporting 2.77 A output. This indicates that the upcoming offering will support 25W fast wired charging which was also confirmed by China’s 3C authority. The charging speed will remain unchanged from last year’s Galaxy A54. Even the base Galaxy S24 maxes out at the same 25W speed.
The certification listings do not reveal any additional details of the Galaxy A55.
Galaxy A55 may see a delayed launch
The certification listings of the Samsung Galaxy A55 may lead to anticipation of its imminent arrival. However, going by a report earlier this month, it might launch later than expected in the second quarter of the year beginning in April. The upcoming offering’s predecessor debuted in mid-March last year.
The leaked renders of the Samsung Galaxy A55 reveal a boxy design with a metal frame replacing the plastic one from its predecessor. This will give the phone a premium look. There is a protrusion on the right side which Samsung calls ‘Key Island’ and the back panel has three vertically stacked camera sensors. We also exclusively shared renders of the smartphone revealing it in three color options.
As per Geekbench, the Samsung Galaxy A55 will reportedly be powered by an Exynos 1480 SoC paired with an AMD GPU and 8GB RAM option.